JPS6076146A - 薄型半導体装置 - Google Patents

薄型半導体装置

Info

Publication number
JPS6076146A
JPS6076146A JP58185744A JP18574483A JPS6076146A JP S6076146 A JPS6076146 A JP S6076146A JP 58185744 A JP58185744 A JP 58185744A JP 18574483 A JP18574483 A JP 18574483A JP S6076146 A JPS6076146 A JP S6076146A
Authority
JP
Japan
Prior art keywords
semiconductor device
adhesive
thin semiconductor
film
films
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58185744A
Other languages
English (en)
Japanese (ja)
Other versions
JPS648467B2 (en]
Inventor
Kazuo Iko
伊香　和夫
Akiko Ono
小野　彰子
Hideto Suzuki
秀人 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP58185744A priority Critical patent/JPS6076146A/ja
Publication of JPS6076146A publication Critical patent/JPS6076146A/ja
Publication of JPS648467B2 publication Critical patent/JPS648467B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5388—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates for flat cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP58185744A 1983-10-03 1983-10-03 薄型半導体装置 Granted JPS6076146A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58185744A JPS6076146A (ja) 1983-10-03 1983-10-03 薄型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58185744A JPS6076146A (ja) 1983-10-03 1983-10-03 薄型半導体装置

Publications (2)

Publication Number Publication Date
JPS6076146A true JPS6076146A (ja) 1985-04-30
JPS648467B2 JPS648467B2 (en]) 1989-02-14

Family

ID=16176095

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58185744A Granted JPS6076146A (ja) 1983-10-03 1983-10-03 薄型半導体装置

Country Status (1)

Country Link
JP (1) JPS6076146A (en])

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02107496A (ja) * 1988-10-18 1990-04-19 Seiko Epson Corp Ｉｃカードの製造方法
WO1997048562A1 (fr) * 1996-06-17 1997-12-24 Mitsubishi Denki Kabushiki Kaisha Procede de production de carte de circuits imprimes fines, et construction de ces dernieres
CN1079053C (zh) * 1996-06-17 2002-02-13 三菱电机株式会社 制造薄ic卡的方法及其结构

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01141153A (ja) * 1987-11-26 1989-06-02 Kato Seisakusho:Kk Ｘ型アウトリガ装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5379379A (en) * 1976-12-24 1978-07-13 Hitachi Ltd Production of semiconductor and divice for the same
JPS5543871A (en) * 1978-09-22 1980-03-27 Casio Comput Co Ltd Packaging of semiconductor device
JPS5714570A (en) * 1980-06-19 1982-01-25 Ppg Industries Inc Preparation of n-benzyloxycarbonylaspartic acid

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5379379A (en) * 1976-12-24 1978-07-13 Hitachi Ltd Production of semiconductor and divice for the same
JPS5543871A (en) * 1978-09-22 1980-03-27 Casio Comput Co Ltd Packaging of semiconductor device
JPS5714570A (en) * 1980-06-19 1982-01-25 Ppg Industries Inc Preparation of n-benzyloxycarbonylaspartic acid

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02107496A (ja) * 1988-10-18 1990-04-19 Seiko Epson Corp Ｉｃカードの製造方法
WO1997048562A1 (fr) * 1996-06-17 1997-12-24 Mitsubishi Denki Kabushiki Kaisha Procede de production de carte de circuits imprimes fines, et construction de ces dernieres
US6207004B1 (en) 1996-06-17 2001-03-27 Mitsubishi Denki Kabushiki Kaisha Method for producing thin IC cards and construction thereof
CN1079053C (zh) * 1996-06-17 2002-02-13 三菱电机株式会社 制造薄ic卡的方法及其结构

Also Published As

Publication number Publication date
JPS648467B2 (en]) 1989-02-14

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